| 氮气保护对无铅焊接工艺温度窗口的影响 |
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| 引用本文： | 赵文军,史建卫. 氮气保护对无铅焊接工艺温度窗口的影响[J]. 电子工业专用设备, 2010, 39(8): 36-40,59 |
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| 作者姓名： | 赵文军 史建卫 |
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| 作者单位： | 深圳市航盛电子股份有限公司,广东,深圳,518103;日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 无铅化电子组装中无铅焊料的高熔点、低润湿性给实际生产带来了很大挑战。为了改善润湿性,可适当提高焊接温度,但由于PCB及元件的工艺温度限制,导致了焊接工艺温度窗口变窄。氮气保护可以改善无铅焊料润湿性、防止氧化、提高焊接品质,更重要的是可以降低焊接峰值温度,扩大焊接工艺温度窗口。
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| 关 键 词： | 氮气保护 无铅焊接 温度窗口 润湿性 |
Nitrogen Protection's Effect on Thermal Process Window In Lead-free Soldering |
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| ZHAO Wenjun,SHI Jianwei. Nitrogen Protection's Effect on Thermal Process Window In Lead-free Soldering[J]. Equipment for Electronic Products Marufacturing, 2010, 39(8): 36-40,59 |
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| Authors: | ZHAO Wenjun SHI Jianwei |
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| Affiliation: | ZHAO Wenjun1,SHI Jianwei2 (1. Shenzhen Hangsheng Electronics Co.,Ltd.,518103,China,2. Sun East Electronic Technology Company Lt.d,Shenzhen,China) |
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| Abstract: | The higher wetting point temperature and lower wettability of solder alloy in lead-free assembly bring major challenges to the actual production. In order to improve wettability, raising the temperature appropriately will led to the narrower soldering process window because of soldering temperature limitation for PCB and components. Nitrogen protection can improve the wettability of lead-free solder alloy, prevent the oxidation and ensure the soldering quality. More importantly, it can minimize soldering pe... |
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| Keywords: | N2 Protection Lead-free Soldering Thermal Process Window Wettability |
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