| 新型纳米结构颗粒增强无铅复合钎料性能 |
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| 引用本文： | 邰枫,郭福,刘彬,申灏,史耀武.新型纳米结构颗粒增强无铅复合钎料性能[J].复合材料学报,2010,27(1):144-149. |
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| 作者姓名： | 邰枫 郭福 刘彬 申灏 史耀武 |
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| 作者单位： | 北京工业大学材料科学与工程学院,北京,100124 |
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| 基金项目： | 北京市科技新星计划基金(2004B03);;霍英东基金(104016) |
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| 摘 要： | 为了解决传统复合钎料制备中强化颗粒容易粗化的问题，提高无铅复合钎料的性能，选用共晶Sn-3.5Ag、Sn-3.0Ag-0.5Cu钎料作为基体，3种不同类型具有纳米结构的有机-无机笼型硅氧烷齐聚物(POSS) 颗粒作为增强相而制成复合钎料。研究了复合钎料的铺展性能、钎焊接头的力学性能和抗蠕变性能。结果表明，复合钎料的润湿性能均优于基体钎料的润湿性能，复合钎料钎焊接头的剪切强度和蠕变断裂寿命均明显提高。在相同条件下，Sn-Ag-Cu基复合钎料钎焊接头的性能优于Sn-Ag基复合钎料钎焊接头。
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| 关 键 词： | 硅氧烷齐聚物 复合钎料 铺展性能 剪切强度 蠕变断裂寿命 |
| 收稿时间： | 2009-01-05 |
| 修稿时间： | 2009-04-15 |
Properties of new nano-structured particles reinforced lead-free composite solders |
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| TAI Feng,GUO Fu,LIU Bin,SHEN Hao,SHI Yaowu.Properties of new nano-structured particles reinforced lead-free composite solders[J].Acta Materiae Compositae Sinica,2010,27(1):144-149. |
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| Authors: | TAI Feng GUO Fu LIU Bin SHEN Hao SHI Yaowu |
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| Affiliation: | College of Materials Science and Engineering;Beijing University of Technology;Beijing 100124;China |
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| Abstract: | In order to solve the coarsening problem of reinforcing particles in fabrication of traditional composite solders and enhance the properties of lead-free composite solders,the eutectic Sn-3.5Ag and Sn-3.0Ag-0.5Cu were selected as solder matrix,and three different nano-sized polyhedral oligomeric silsesquioxane(POSS) particulates were used as reinforcing particles to form composite solders.The spreadability properties,mechanical performance,and creep rupture lives of solder matrix and their new composite sol... |
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| Keywords: | POSS composite solder spreadability property shear strength creep rupture life |
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