| 微流控芯片注射成型流动平衡数值模拟分析 |
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| 引用本文： | 李凯,蒋炳炎,楚纯朋,王璋. 微流控芯片注射成型流动平衡数值模拟分析[J]. 塑料工业, 2011, 39(12) |
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| 作者姓名： | 李凯 蒋炳炎 楚纯朋 王璋 |
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| 作者单位： | 中南大学机电工程学院 现代复杂装备设计与极端制造教育部重点实验室,湖南长沙,410083 |
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| 摘 要： | 针对微流控芯片模内键合的动作要求,设计了浇注系统,并进行了微流控芯片流动平衡的充填仿真研究,对模具的浇注系统的尺寸进行了优化,研究结果表明:盖片的浇口尺寸对流动平衡的影响非常小,基片分流道高度对流动平衡影响较显著。随着基片分流道高度的减小,基片与盖片的充填时间越来越接近,当基片分流道高度降至1.5mm时,基片与盖片的充填时间只相差0.003 1 s,流动不平衡率仅有2.5%。
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| 关 键 词： | 微流控芯片 注射成型 流动平衡 浇注系统 |
Numerical Simulation of Flow Balance for Microfluid Chip Injection Molding |
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| LI Kai,JIANG Bing-yan,CHU Chun-peng,WANG Zhang. Numerical Simulation of Flow Balance for Microfluid Chip Injection Molding[J]. China Plastics Industry, 2011, 39(12) |
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| Authors: | LI Kai JIANG Bing-yan CHU Chun-peng WANG Zhang |
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| Affiliation: | LI Kai,JIANG Bing-yan,CHU Chun-peng,WANG Zhang(Key Lab of Modern Complex Equipment Design and Extreme Manufacturing Ministry of Education,College of Electromechanical Engineering,Central South University,Changsha 410083,China) |
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| Abstract: | In this study,the runner system of the mold was designed according to the specific functions of the in-mold bonding and the size was optimized.The filling simulation study on the flow balance for microfluid chip injection molding was processed.The simulation results showed that the gate size of the cover cavity had little effect on flow balance while the runner height of the substrate cavity exerted a significant effect on flow balance.It was further revealed that the filling time for cover and substrate ca... |
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| Keywords: | Microfluid Chip Injection Molding Flow Balance Runner System |
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