| LTCC工艺技术研究 |
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| 引用本文： | 张丽华,张金利. LTCC工艺技术研究[J]. 半导体技术, 2010, 35(8): 810-812. DOI: 10.3969/j.issn.1003-353x.2010.08.018 |
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| 作者姓名： | 张丽华 张金利 |
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| 作者单位： | 中国电子科技集团公司,第十三研究所,石家庄,050051;中国电子科技集团公司,第十三研究所,石家庄,050051 |
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| 摘 要： | 叙述了LTCC技术的起源、特点及未来发展趋势.介绍了LTCC产品的种类、优越性及广阔的应用领域,对LTCC工艺技术中高精度金属化印刷技术和陶瓷高温共烧技术进行了深入研究,剖析了影响金属化印刷精度、导体表面粗糙度、LTCC基板翘曲度和陶瓷强度的工艺因素.并分析了如何根据产品布线特点来设计和优化印刷工艺参数、如何根据基板结构特点来设计和优化排胶曲线.通过大量的工艺试验和数据测试,结果表明,印刷压力影响金属化导体精度和表面粗糙度、烧结曲线排胶段升温速率影响LTCC基板翘曲度和陶瓷强度.
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| 关 键 词： | 低温共烧陶瓷 基板 印刷 烧结 |
Study of LTCC Processing Technology |
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| Zhang Lihua,Zhang Jinli. Study of LTCC Processing Technology[J]. Semiconductor Technology, 2010, 35(8): 810-812. DOI: 10.3969/j.issn.1003-353x.2010.08.018 |
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| Authors: | Zhang Lihua Zhang Jinli |
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| Affiliation: | Zhang Lihua,Zhang Jinli(The 13th Research Institute,CETC,Shijiazhuang 050051,China) |
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| Abstract: | The origin,characteristics and the future development trend of LTCC technology is described.The types of products,the superiority of LTCC and broad application field of LTCC technology are introduced.High precision metal printing technology and ceramics high temperature co-firing technology are studied. The technology factors are analyzed which influence the moralized printing precision,conductor surface roughness,LTCC substrate warping and intensity of ceramic.How to design and optimize the printing proces... |
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| Keywords: | low temperature co-fired ceramic(LTCC) substrate printing sintering |
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