| 日本电镀技术的发展 |
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| 引用本文： | 林忠夫.日本电镀技术的发展[J].电镀与精饰,2002,24(1):39-44. |
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| 作者姓名： | 林忠夫 |
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| 摘 要： | 简要介绍了1950年以前日本电镀技术及电镀工业的发展概况，1950年后，由于引进了先进的电镀技术，材料，设备并随着汽车和电子工业的发展，带动了日本电镀工业的发展，叙述了含金电镀、复合电镀、脉冲电镀和化学镀等科研成果及其使用情况。
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| 关 键 词： | 电镀技术 合金电镀 复合电镀 脉冲电镀 化学镀 |
| 文章编号： | 1001-3849(2002)01-0039-06 |
| 修稿时间： | 2001年11月20日 |
Development of Electroplating Technology in Japan |
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| TADAO HAYASHI.Development of Electroplating Technology in Japan[J].Plating & Finishing,2002,24(1):39-44. |
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| Authors: | TADAO HAYASHI |
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| Affiliation: | TADAO HAYASHI |
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| Abstract: | General situation of development of electroplating technology and eletroplating industry in Japan before 1950 is briefly introduced. The development of electroplating industry in Japan has been promoted because of the introduction of advanced electroplating technology, materials and equipmetns, and along with the development of industries of automobile and electronics since 1950. Scientific research achievements in alloy electroplating, composite electroplating, pulse electroplating and chemical plating, and their application situation are described. |
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| Keywords: | electroplating technology alloy electroplating composite electroplating pulse electroplating chemical plating |
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