| In-Sn熔体合金与CuZr基块状非晶合金界面生长动力学(英文) |
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| 引用本文： | 马国峰,张波,张海峰,胡壮麒.In-Sn熔体合金与CuZr基块状非晶合金界面生长动力学(英文)[J].中国有色金属学会会刊,2012(4):837-841. |
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| 作者姓名： | 马国峰 张波 张海峰 胡壮麒 |
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| 作者单位： | 沈阳大学辽宁省先进材料制备技术重点实验室;中国科学院金属研究所 |
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| 基金项目： | Project (2011CB606301) supported by the National Basic Research Program of China;Project (20212339) supported by the Doctor Startup Foundation Program of Shenyang University,China |
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| 摘 要： | 研究In-Sn熔体合金与Cu40Zr44Al8Ag8块状非晶合金的界面生长动力学。通过扫描电镜和能谱对时效的样品进行分析,发现界面层由Zr、Cu和Sn组成。在时效温度区间,扩散机制是反应速度的控制步骤,且时间指数值近似为0.5。计算得到的反应激活能为98.35kJ/mol。
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| 关 键 词： | 块状非晶 界面层 动力学 扩散机制 |
Growth kinetics for intermetallic compound layer between molten In-Sn alloy and CuZr-based bulk metallic glass |
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| MA Guo-feng,ZHANG Bo,ZHANG Hai-feng,HU Zhuang-qi.Growth kinetics for intermetallic compound layer between molten In-Sn alloy and CuZr-based bulk metallic glass[J].Transactions of Nonferrous Metals Society of China,2012(4):837-841. |
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| Authors: | MA Guo-feng ZHANG Bo ZHANG Hai-feng HU Zhuang-qi |
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| Affiliation: | 1.Key Laboratory of Advanced Materials Fabrication Technology of Liaoning Province,Shenyang University,Shenyang 110044,China 2.Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China |
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| Abstract: | The growth kinetics of intermetallic compound layer between molten In-Sn alloy and Cu40Zr44Al8Ag8 bulk metallic glass substrate was examined by solid state isothermal aging at the temperature range between 333 and 393 K.The aged samples were characterized by scanning electron microscopy and energy dispersive spectrometry.It is found that the intermetallic compound layer is composed of Zr,Cu and Sn.The layer growth of the intermetallic compound is mainly controlled by a diffusion mechanism over the temperature range and the value of the time exponent is approximately 0.5.The apparent activation energy for the growth of total intermetallic compound layers is 98.35 kJ /mol calculated by the Arrhenius equation. |
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| Keywords: | bulk metallic glass compound layer kinetics diffusion mechanism |
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