Fine structures of residual strain distribution in Fe-Doped lnP-100) wafers grown by the LEC and VCZ methods |
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Authors: | Masayuki Fukuzawa Masayoshi Yamada |
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Affiliation: | (1) Department of Electronics and Information Science, Kyoto Institute of Technology, 606 Matsugasaki, Sakyo-ku, Kyoto, Japan |
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Abstract: | By using a high-spatial-resolution scanning infrared polariscope, in-plane components of residual strain have been characterized
quantitatively in 2′Φ wafers of Fe-doped InP( 100) single crystals grown by the liquid-encapsulated Czochralski (LEC) and
the vapor pressure controlled Czochralski (VCZ) methods. The twodimensional distribution maps of LEC-grown wafers reveal characteristic
fine structures such as slip-like patterns originated from crystallographic glides during the crystal growth process, highly
strained spots and filaments due to inclusions or voids inside the wafer, or due to scratches on the surface. The sliplike
patterns are seldom observed in the VCZ-grown wafers. The residual strain value averaged over the whole region of wafer is
also examined, together with etch pit density and resistivity, as a function of the solidified fraction. It is found that
the residual strain in the Fe-doped InP crystals grown by the LEC and VCZ methods mainly depends on the thermal stress during
the growth process rather than on the impurity-hardening effect of Fe.Key words: InP, infrared polariscope, liquid-encapsulated Czochralski (LEC) method, residual strain, vapor pressure controlled Czochralski
(VCZ) method |
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