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脉冲电沉积超细晶粒Ni-Mn合金的显微硬度
引用本文:杨建明,朱荻,曲宁松. 脉冲电沉积超细晶粒Ni-Mn合金的显微硬度[J]. 表面技术, 2004, 33(6): 40-42
作者姓名:杨建明  朱荻  曲宁松
作者单位:淮海工学院机械工程系,江苏,连云港,222005;南京航空航天大学机电学院,江苏,南京,210016
基金项目:国家自然科学基金 , 国防预研基金
摘    要:利用冲液装置和高频窄脉宽脉冲电流,开展了Ni-Mn合金的电沉积试验,得到的沉积层具有接近或达到纳米级的超细晶粒.对电沉积所得到的试片进行了显微硬度测试,研究与分析了电沉积工艺条件对沉积层显微硬度的影响.结果表明,电沉积工艺条件通过影响沉积层的锰含量和晶粒大小而影响沉积层的显微硬度.

关 键 词:电沉积  Ni-Mn合金  显微硬度  脉冲电流
文章编号:1001-3660(2004)06-0040-03

Study on Microhardness of Pulse Electrodeposited Ultrafine Grain Ni-Mn Alloy
YANG Jian-ming,ZHU Di,QU Ning-song. Study on Microhardness of Pulse Electrodeposited Ultrafine Grain Ni-Mn Alloy[J]. Surface Technology, 2004, 33(6): 40-42
Authors:YANG Jian-ming  ZHU Di  QU Ning-song
Affiliation:YANG Jian-ming~1,ZHU Di~2,QU Ning-song~2
Abstract:The electrodeposition of Ni-Mn alloy is carried out by using the device with flushing electrolyte and the pulse current with high frequency. The ultrafine grained deposits, which the grain sizes are close to or down to the order of nanometer, are obtained. The effects of deposition conditions on microhardness of the deposits are studied by means of microhardness tests. It is shown that the deposition conditions influence microhardness by varying Mn content and the grain size of the deposits.
Keywords:Electrodeposition  Ni-Mn alloy  Microhardness  Pulse current
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