| 崭露头角的系统封装 |
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| 引用本文： | 林金堵. 崭露头角的系统封装[J]. 印制电路信息, 2008, 0(5): 9-12 |
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| 作者姓名： | 林金堵 |
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| 作者单位： | CPCA 顾问本刊主编 |
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| 摘 要： | 文章概述了系统封装（SIP）的概念、特点和问题点。着重指出，系统封装（SIP）是由MCM和MCP深入发展和改革而发展起来的。系统封装（SIP）技术是电子产品的组装技术和走向微小型化的未来。
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| 关 键 词： | 系统封装 多芯片模块 多芯片封装 系统功能 确认好的裸芯片 |
| 文章编号： | 1009-0096(2008)05-0009-04 |
SIP of the Visible |
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| LIN Jin-du. SIP of the Visible[J]. Printed Circuit Information, 2008, 0(5): 9-12 |
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| Authors: | LIN Jin-du |
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| Abstract: | The paper describes that the characterization and problem of SIP.It is indeed the rebirth of a concept that has been with us for many years, first as MCM and then as MCP. SIP is indeed the feature of the assembly and the micro-miniaturization in electronic products. |
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| Keywords: | SIP(SOP) MCM(multichip module) MCP(multichip component packages) functional system KGD(known good die) |
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