Residual stress development during the composite patch bonding process: measurement and modeling |
| |
| Affiliation: | 1. Department of Mechanical Engineering, University of New Brunswick, P.O. Box 4400, Fredericton, NB, Canada E3B 5A3;2. National Research Council Canada, Institute for Aerospace Research, 1500 Montreal Road, Building M-3, Ottawa, Ont., Canada K1A 0R6;1. Faculty of Aerospace Engineering, Shenyang Aerospace University, China;2. Department of Mechanical Engineering, The Hong Kong Polytechnic University, China;3. Smart Structures and Composites Lab, Harbin Engineering University, China;1. Materials Engineering, The Open University, Walton Hall, Milton Keynes MK7 6AA, UK;2. Faculty of Engineering and Computing, Coventry University, Priory Street, Coventry CV1 5FB, UK;3. School of Applied Sciences, Cranfield University, Bedfordshire MK43 0AL, UK |
| |
| Abstract: | This paper presents an experimental technique for monitoring residual stress development throughout the composite patch repair curing process. Using this technique, process-induced strains and specimen warpage during a number of different cure cycles were measured for a simulated single-sided composite patch repair of an aluminum substrate. Models for adhesive cure rate and glass transition behavior of the patch adhesive resin (FM 300-1K) were combined with a simple bi-metallic strip model to predict specimen warpage and strain behavior during cure. Model predictions were compared with experimental measurements and were used to assist in the development of optimized cure cycles. Using these optimized cycles, it was found that it was possible to achieve significant (>20%) reductions in patch warpage and at the same time, minimize processing time and obtain a high final adhesive degree of cure. Experimental observations suggest that an improved patch model incorporating adhesive viscoelastic behavior during cure would assist in achieving additional process improvements. |
| |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
