| Abstract: | Epoxy resins containing both phosphorous and silicon were prepared via the fusion process of reacting a phosphorous diol and a silicon diol with a bisphenol‐A‐type epoxy. With various feeding ratios of the reactants, epoxy resins with different phosphorous and silicon contents were obtained. Through curing the epoxies with diaminodiphenylmethane, the cured epoxy resins exhibit tailored glass transition temperatures (159–77°C), good thermal stability (>320°C), and high char yields at 700°C under air atmosphere. The high char yield was demonstrated to come from the synergistic effect of phosphorous and silicon, where phosphorous enriches char formation and silicon protects the char from thermal degradation. Moreover, high flame retardancy of the epoxy resins was found by the high LOI value of 42.5. The relationship of the char yields at 700°C under air atmosphere (ρ) and the LOI values of the epoxy resins could be expressed as LOI = 0.62ρ + 19.2. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 87: 404–411, 2003 |
