| 化学镀镍-磷合金机理的研究 |
| |
| 引用本文： | 郭鹤桐,刘淑兰,王金根.化学镀镍-磷合金机理的研究[J].化学工业与工程,1990(Z1). |
| |
| 作者姓名： | 郭鹤桐 刘淑兰 王金根 |
| |
| 作者单位： | 天津大学应用化学系，天津大学应用化学系，天津大学应用化学系 |
| |
| 摘 要： | 通过对化学镀Ni—P合金过程中线性极化电阻及沉积速度的测量,得出极化电阻的倒数1/Rp与电流密度i呈线性关系。用阳极极化曲线的方法,较详细地研究了次磷酸钠在镍电极上的氧化过程。提出了化学镀Ni—P合金是按电化学机理进行的。
|
Study on the Mechanism of Electroless Plating of Ni-P Alloy |
| |
| Guo Hetong,Liu Shulan,Wang Jingen.Study on the Mechanism of Electroless Plating of Ni-P Alloy[J].Chemical Industry and Engineering,1990(Z1). |
| |
| Authors: | Guo Hetong Liu Shulan Wang Jingen |
| |
| Abstract: | Linear relation between 1/Rp and i of the deposition process of Ni-P alloy electroless plating was obtained through the measurements of linear polarization resistance and deposition rate of the process. Oxidation process of hypophosphite on Ni electrode was studied in more detail with anodic polarization curve method. It was proposed that deposition of Ni-P alloy in electroless plating is proceeded according to the electrochemical mechanism. |
| |
| Keywords: | electroless plating Ni-P alloy deposition rate polarization resistance |
| 本文献已被 CNKI 等数据库收录！ |
