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共聚改性氰酸酯树脂及其性能
引用本文:尹剑波,梁国正. 共聚改性氰酸酯树脂及其性能[J]. 塑料工业, 2001, 29(1): 36-38
作者姓名:尹剑波  梁国正
作者单位:1. 西北工业大学应用物理系
2. 西北工业大学化学工程系
摘    要:利用环氧树脂和双马来酰亚胺树脂做改性剂,对氰酸酯树脂进行共聚改性,通过对粘度的测量描述了共聚树脂的固化反应情况。性能测试表明内聚改性氰酸酯树脂的冲击强度比纯氰酸酯树脂自聚体提高了2倍多,可达12.3kJ/cm^2,热变形温度高达235℃,并具有优异的介电性能,如10kHz 介电常数为2.25,介电损耗角正切<10^-4。共聚树脂中的配比和固化条件对性能有影响。

关 键 词:聚氰酸酯树脂 环氧树脂 双马来酰亚胺树脂 介电性能 韧性 耐热性 共聚 改性
修稿时间:2000-06-05

Properties of CopolymerModification of Epoxy Resin
Yin Jianbo,LIANG Guozheng. Properties of CopolymerModification of Epoxy Resin[J]. China Plastics Industry, 2001, 29(1): 36-38
Authors:Yin Jianbo  LIANG Guozheng
Abstract:Epoxy resin and bismaleimide resin were used as modifiers for cyanate resin,and the reaction was described by means of viscosity determination.The results showed the impact strength of the copolymer of EP(F-51)/BMI/BCE was 2 times higher than that of pure polycyanate resin,being 12.3kJ/cm2,with a thermal deformation temperature up to 235℃.The copolymer also had a better dielectric property with ε=2.25 and tan δ<10-4.The volume fraction and reaction technique had important effects on the properties of the modified system.
Keywords:Cyanate Ester Resin Epoxy Resin Bismaleimide Resin Dielectric Property Toughening Heat Resistan
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