Overview of fatigue performance of Cu processed by severe plastic deformation |
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Authors: | S R Agnew A Yu Vinogradov S Hashimoto J R Weertman |
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Affiliation: | (1) Northwestern University, 60208 Evanston, IL, USA;(2) Kanazawa University, 920-5667 Kanazawa, Japan;(3) Kyoto University, 606-8501 Kyoto, Japan;(4) Present address: Oak Ridge National Laboratory, 37831 Oak Ridge, TN, USA;(5) Present address: Osaka City University, 558-8585 Osaka, Japan |
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Abstract: | This study investigates discrepancies regarding cyclic softening of Cu processed by severe plastic deformation (SPD). All
samples softened if the microhardnesses before and after fatiguing are compared. However, the effect decreases if the strain
amplitude is small, Δεp <1 × 10−3). Samples with equiaxed subgrains were more resistant to softening and thermal recovery. All samples had “persistent” shear
bands except those tested at the highest amplitudes, Δεp >1 × 10−2. Cu processed by SPD exhibits an enhanced fatigue life at low amplitudes. However, low thermal stability, potential for softening,
and poor low-cycle properties discredit this advantage. |
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Keywords: | Fatigue copper ultrafine grain cyclic softening shear bands persistent slip bands severe plastic deformation |
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