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HAP/SiCw复合生物陶瓷材料的超声波加工
引用本文:牛宗伟,张建华,李丽,孟艳华. HAP/SiCw复合生物陶瓷材料的超声波加工[J]. 工具技术, 2004, 38(9): 79-81
作者姓名:牛宗伟  张建华  李丽  孟艳华
作者单位:山东大学;山东大学;山东理工大学
摘    要:研究了用超声波加工技术对HAP/SiC复合生物陶瓷材料进行加工时晶须取向对加工机理、材料去除率和加工表面粗糙度的影响。研究结果表明材料去除率和加工表面粗糙度随晶须方向角的增大而增大。在相同的加工条件下 ,材料的断裂韧性越高 ,其MMR越小。该研究为HAP/SiCw复合生物陶瓷材料的超声波加工提供了工艺依据

关 键 词:超声波加工  复合材料  材料去除率  表面粗糙度

Ultrasonic Machining of HAP/SiCw Composite Bioceramics Material
Niu Zongwei Zhang Jianhua Li Li et al. Ultrasonic Machining of HAP/SiCw Composite Bioceramics Material[J]. Tool Engineering(The Magazine for Cutting & Measuring Engineering), 2004, 38(9): 79-81
Authors:Niu Zongwei Zhang Jianhua Li Li et al
Affiliation:Niu Zongwei Zhang Jianhua Li Li et al
Abstract:The influence of whisker orientation on machining mechanism, material removal rate and roughness of finished surface when machining the HAP/SiC w composite bioceramics material by using ultrasonic machining technology is studied. The results show that material removal rate and roughness of finished surface will increase with the increase of the direction angle θ?Under the same machining condition, the higher is the fracture toughness of the material, the lower is the material removal rate. This fact provides technological basis for the ultrasonic machining of HAP/SiC w composite bioceramics material.
Keywords:ultrasonic machining   composite material   material removal rate   roughness
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