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Thin-film encapsulation of top-emission organic light-emitting devices with polyurea/Al2O3 hybrid multi-layers
Authors:Young Gu Lee  Yun-Hyuk Choi  In Seo Kee  Hong Shik Shim  YongWan Jin  Sangyoon Lee  Ken Ha Koh  Soonil Lee  
Affiliation:aReformable Display Group, Samsung Advanced Institute of Technology, Samsung Electronics, P.O. Box 111, Suwon 440-600, Republic of Korea;bDivision of Energy Systems Research, Ajou University, Suwon 442-749, Republic of Korea
Abstract:We developed a room-temperature encapsulation process based on multi-stack of ultra thin Al2O3 and polyurea layers for top-emission organic light-emitting devices (TEOLEDs). Device structure, including a capping layer for refractive-index matching and a thick polyurea buffer layer, was optimized to enhance light extraction without distorting electroluminescence spectrum. The efficiency of a TEOLED encapsulated with 5 pairs of Al2O3(50 nm)/polyurea(20 nm) layers was better than that of a glass-encapsulated TEOLED, whereas their color coordinates were almost identical. Moreover, the half-decay lifetime of a TEOLED encapsulated with 5 pairs of Al2O3/polyurea layers was 86% of that of a glass-encapsulated TEOLED. Water vapor transition rate of 5 pairs of Al2O3(50 nm)/polyurea(20 nm) layers on PET film was measured as low as 5 × 10−4 g/m2 day.
Keywords:Encapsulation  Hybrid multi-layers  Polyurea  Top-emission OLED
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