应用于聚合物复合弹性体柔性封装的阳极键合

采用预聚体法制备了三种应用于阳极键合柔性封装的聚合物复合弹性体(PEO-PUEs)阴极材料,并在室温下浇注固化。PEO-PUEs复合材料具有良好的耐热性和柔顺性,5%热分解温度T_d,5%高于250℃,玻璃化转变温度T_g低于-40℃,且力学性能良好。当1,4-丁二醇(BDO)含量为50wt%、三羟甲基丙烷(TMP)含量为50wt%、SiO₂含量为1wt%时,PEO-PUEs复合材料在阳极键合温度下(65℃)具有较高的离子导电率,PEOPUEs复合材料的离子导电率最高可达1.50×10^-3 S·cm^-1,符合阳极键合对阴极材料的要求。设计了专用于聚合物复合材料的热引导动态场阳极键合工艺,并成功应用于PEO-PUEs复合材料与Al箔的阳极键合连接,当BDO含量为50wt%、TMP含量为50wt%、SiO₂含量为1wt%时,PEO-PUEs复合材料和Al箔阳极键合的连接性能最好,键合界面拉伸强度达1.26 MPa。通过与传统阳极键合工艺对比,热引导动态场阳极键合具...

Anodic bonding applied to flexible packaging using polymer elastomer composites

Three kinds of polymer elastomer(PEO-PUEs)composites as cathode materials for anodic bonding were prepared via pre-polymerization method casted and cured at room temperature.The PEO-PUEs composites were characterized by good heat resistance that the 5%thermal decomposition temperatures T_d,5%are higher than 250℃.The glass transition temperatures T_gare lower than-40℃showing good flexibility.The PEO-PUEs composites have good mechanical properties.All PEO-PUEs composites have high ionic conductivity meeting the requirements of anodic bonding for cathode materials,and the highest value at 65℃(the temperature required for anodic bonding)is reached to 1.50×10^-3S·cm^-1for PEO-PUEs composites(butane-1,4-diol(BDO)content is 50 wt%,trimethylolpropane(TMP)content is 50 wt%and SiO₂content is 1 wt%).The anodic bonding by thermal guidance and dynamic field for polymer materials was designed,which was successfully used for jointing of PEO-PUEs composites with Al foil.When BDO content is 50 wt%,TMP content is 50 wt%and SiO₂content is 1 wt%,the PEO-PUEs composites with Al foil have the best bonding performance,and the highest value of tensile strength can reach to 1.26 MPa.Compared with the traditional anodic bonding,the joint of PEO-PUEs composites with Al by anodic bonding designed with thermal guidance and dynamic field have a stable and dense intermediate bonding layer,and the peak current and bonding time are significantly improved,and the bonding interface strengthes are higher.This study provides some theoretical basis and reference experience for the practical application of anodic bonding in flexible packaging from the aspects of preparing polymer cathode materials and designing the corresponding anodic bonding process.