本征导热高分子材料研究进展

导热高分子复合材料因轻质、设计自由度大及易加工等优势获得了广泛的工业应用，但也面临着热导率k与介电强度E_b之间无法协同提高的严峻问题，严重影响和限制了其在高压电力绝缘设备领域的工业应用。而基于提高无序结构聚合物的结构有序性而获得本征导热高分子(ITCP)的策略，不但同步提高E_b及k，还保留了其自身卓越的综合性能。本文讨论了本征聚合物的导热机制，系统分析了本征k的影响因素，综述了两类不同结构ITCP的研究进展，探讨了聚合物微结构、取向、氢键作用、液晶基元及固化剂、加工方式等因素对本征k的影响机制，阐述了提高聚合物有序结构及本征k的途径。最后总结了当前ITCP研究中存在的问题及未来研究方向，综合性能优异的ITCP在高密度封装微电子、高电压及大功率电力设备等领域具有重要用途，代表了导热高分子的未来发展方向。 

Progress in intrinsic thermally conductive polymers

Thermally conductive polymer composites have been widely applied in various industries due to lightweight, flexible design and easy-processing. However, the thermal conductivity k and dielectric breakdown strength E_b of polymer composites cannot be synergistically enhanced, thereby seriously affecting and limiting their applications in the high-voltage power equipment. The intrinsic thermally conductive polymers (ITCP) resulting from the developed ordered structures based on pristine discorded structures, not only reserve inherent excellent overall properties, but also exhibit a concurrent enhancement in both E_b and k. This paper discussed the heat conduction mechanism and analyzed the factors influencing k of intrinsic polymers, and summarized the latest advances in ITCP. Furthermore, the factors influencing k, such as polymer structure, orientation, hydrogen bonding, mesomorphic unit and curing agents, processing methods, were analyzed, as well as the strategies to improve the ordered arrangement and k of polymer microstructures. Finally, this paper summarized the existing questions in the study of ITCP and pointed out the future research direction of ITCP. The ITCP show important applications in high-density electronic packaging and high-voltage power equipment, representing the future development direction of thermally conductive polymer composites.