Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging |
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Authors: | Qian Wang Sung-Hoon Choa Woonbae Kim Junsik Hwang Sukjin Ham Changyoul Moon |
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Affiliation: | (1) Package Center, Samsung Advanced Institute of Technology, 440-600 Gyunggi-do, Korea;(2) Nano Device Lab, Samsung advanced Institute of Technology, Korea |
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Abstract: | Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical
system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance,
and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature
hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology
at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 μm in width is performed. The
electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package
is 1 mm × 1 mm × 700 μm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any
organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB
at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical
damage of the package after several reliability tests. |
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Keywords: | Radio-frequency-microelectromechanical system (RF-MEMS) wafer level packaging Au-Sn bonding hermeticity |
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