| 丁二酰亚胺无氰镀银工艺 |
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| 引用本文： | 周永璋,丁毅,陈步荣.丁二酰亚胺无氰镀银工艺[J].表面技术,2003,32(4):51-52. |
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| 作者姓名： | 周永璋 丁毅 陈步荣 |
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| 作者单位： | 南京工业大学材料学院,江苏,南京,210009 |
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| 摘 要： | 研究了丁二酰亚胺无氰镀银工艺中各组分含量的变化，对银镀层在附着力、光亮度等方面性能的影响，找出各自的最佳配比；通过改变阴极电流密度、pH值考察对银镀层质量的影响，找出最佳工艺条件，得到适宜的丁二酰亚胺无氰镀银工艺。
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| 关 键 词： | 丁二酰亚胺 无氰镀银 外观 结合力 电沉积速度 阴极电流效率 |
| 文章编号： | 1001-3660(2003)04-0051-02 |
Butanedimide Cyanide-free Silver Plating |
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| ZHOU Yong zhang,DING Yi,CHEN Bu rong.Butanedimide Cyanide-free Silver Plating[J].Surface Technology,2003,32(4):51-52. |
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| Authors: | ZHOU Yong zhang DING Yi CHEN Bu rong |
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| Abstract: | In this paper, the proprieties of deposit are studied, such as adhesion, brightness etc. in the process of butanedimide cyanide-free sliver plating, in various content of components and found the optimum contents. By evaluating the qualities of plating under the operation of various water density and pH, the optimum process conditions are discovered. Finally, a technique suit able for butanedimide cyanide-free sliver plating is found. |
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| Keywords: | Butanedimide Cyanide-free sliver plating Appearance Adhesion Rate of sediment Cathode efficiency |
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