| 基于微通道致冷的大功率LED阵列封装热分析 |
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| 引用本文： | 袁柳林,刘胜,陈明祥,罗小兵. 基于微通道致冷的大功率LED阵列封装热分析[J]. 半导体光电, 2006, 27(6): 712-716 |
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| 作者姓名： | 袁柳林 刘胜 陈明祥 罗小兵 |
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| 作者单位： | 1. 华中科技大学微系统研究中心,湖北,武汉,430074
2. 华中科技大学能源与动力学院,湖北,武汉,430074 |
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| 摘 要： | 采用微通道致冷技术,设计了大功率LED阵列封装的微通道致冷结构,并应用热分析软件模拟了其热性能,探讨不同鳍片结构尺寸、流速、功率等参数对LED多芯片散热效果的影响.文中提出了采用交错通道以提高LED封装的散热能力,模拟结果显示,交错微通道致冷的封装结构能很好地满足大功率LED阵列的散热需要.
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| 关 键 词： | 大功率LED 微通道 交错鳍片 散热 封装 微通道 致冷技术 大功率 阵列封装 热分析 Cooler Microchannel Packaging Array High Power Analysis 散热能力 封装结构 显示 模拟结果 影响 散热效果 多芯片 参数 流速 |
| 文章编号： | 1001-5868(2006)06-0712-05 |
| 收稿时间： | 2006-04-17 |
| 修稿时间： | 2006-04-17 |
Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler |
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| YUAN Liu-lin,LIU Sheng,CHEN Ming-xiang,LUO Xiao-bing. Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler[J]. Semiconductor Optoelectronics, 2006, 27(6): 712-716 |
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| Authors: | YUAN Liu-lin LIU Sheng CHEN Ming-xiang LUO Xiao-bing |
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| Affiliation: | 1. Institute of Mierosystems; 2. Institute of Energy and Power, Huazhong University of Science and Technology, Wuhan 430074, CHN |
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| Abstract: | The packaging structure of high power LED arrays integrated with microchannel cooler has been discussed.Detailed heat transfer performance has been analyzed using the finite element analysis(FEA) technology.The effects have been discussed on the cooling of multi-chip LED module with different internal fin geometry of module,velocity of flow and total power.The cooling scheme has been optimized by using staggered fins in microchannel coolers to increase the heat transfer coefficient of the multi-chip LED module packaging.The result shows that the packaging structure of the microchannel cooler with staggered fins can achieves good thermal performance for high power LED array. |
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| Keywords: | high power LED microchannel, staggered fins cooling packaging |
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