Interfacial Microstructure between WC-Based Cermet and Cu Alloy |
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Authors: | Xinhong WANG Zengda ZOU Sili SONG Shiyao QU |
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Affiliation: | School of Materials Science and Engineering, Shandong University, Jinan 250061, China |
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Abstract: | A WC-TiC-Co/CuZnNi composite layer was produced on 1045 steel substrate by means of inside-furnace brazing technique. The microstructure, phase constituent and interfacial diffusion behavior between cermet and CuZnNi alloy were investigated by means of scanning electron microscopy (SEM), transmission electron microscope (TEM), electron probe microanalyzer (EPMA) and X-ray diffraction. The results showed that microstructure of matrix was α andβ phases. Cermet particles were surrounded by the α β phases in the composite layer and their sizes were almost similar to those in original state. The interfacial zone was formed by the mutual diffusion of elements under the condition of high temperature. The interface consists of WC, TiC, CuZn, and CuNi phases, and there are no microcracks and inclusions near the interface. |
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Keywords: | Cu-base alloy WO-based cermet Interface behavior Microstructure |
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