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NH_3 Plasma Surface Treatments of Engineering Fluoropolymers: A Way to Enhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating
引用本文:Maurice Romand,Marlene Charbonnier,Yves Goepfert. NH_3 Plasma Surface Treatments of Engineering Fluoropolymers: A Way to Enhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating[J]. 材料热处理学报, 2004, 25(5)
作者姓名:Maurice Romand  Marlene Charbonnier  Yves Goepfert
作者单位:Laboratoire de Sciences et Ingenierie des Surfaces and,Laboratoire de Sciences et Ingenierie des Surfaces and,UMR 5180 des Sciences Analytiques,Universite Claude Bernard - Lyon 1,69622 Villeurbanne Cedex,France
摘    要:FLUOROPOLYMERS(FPs)are thermoplasticmaterials which exhibit a number of unique chemicaland physical characteristics that no other man-madeplastic product gets together.For example,FPs showvery good resistance to almost all chemicals,excellentwater vapor barrier properties,high thermal stability,outstanding electrical insulation properties(lowdielectric constant and dissipation factors),extremelylow frictional coefficient giving them high auto-lubrication properties,high resistance to rad…


NH3 Plasma Surface Treatments of Engineering Fluoropolymers:A Way toEnhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating
Maurice Romand,Marlène Charbonnier,Yves Goepfert. NH3 Plasma Surface Treatments of Engineering Fluoropolymers:A Way toEnhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating[J]. Transactions of Materials and Heat Treatment, 2004, 25(5)
Authors:Maurice Romand  Marlène Charbonnier  Yves Goepfert
Affiliation:Laboratoire de Sciences et Ingenierie des Surfaces and 2. UMR 5180 des Sciences Analytiques, Universite Claude Bernard - Lyon 1, 69622 Villeurbanne Cedex, France
Abstract:This paper describes the electroless Ni or Cu plating of some fluoropolymer substrates through a tin-free activation process. Materials subjected to surface metallization are commercial Teflon FEP, Nafion , ACLAR and LaRC?-CPl thin films which have recently gained a large scientific and technological interest due to their excellent thermal, chemical, mechanical and dielectric properties. The original approach implemented in the present work involves: (i) the grafting of nitrogen-containing functionalities on the polymer surfaces through plasma treatments in ammonia, (ii) the direct catalysis of the so-modified surfaces via their immersion in a simple acidic PdCl2 solution (i.e. without using a prior surface sensitization in an acidic SnQ2 solution), and finally (iii) the electroless metallization itself. However, prior to the immersion in the industrial plating baths, the chemical reduction of the Pd+2 species (species covalently tethered on the nitrogen-containing groups) to metallic palladium (Pd ) is shown to be a key factor in catalyzing the electroless deposition initiation. This is made by immersion in an hypophosphite (H2PO2~) solution. Wettability measurements and X-ray photoelectron spectroscopy (XPS) experiments are used to characterize every surface modification step of the developed process. A cross-hatch tape test was used to asses the adhesion strength of the electroless films that is shown qualitatively good. In addition, a fragmentation test was developed in combination with electrical measurements. Its use allows to distinguish different adhesion levels at the metal/polymer interface and to evidence the influence of some processing parameters.
Keywords:Ni electroless plating   Cu electroless plating   Polymer surfaces   Plasma surface treatment   Surface functionalization   Surface catalysis   Surface analysis (XPS)   Adhesion testing.
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