| 树状结构多芯片组件互连网络延迟的研究 |
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| 引用本文： | 来金梅,林争辉,李珂. 树状结构多芯片组件互连网络延迟的研究[J]. 计算机辅助设计与图形学学报, 1999, 11(1): 85-88 |
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| 作者姓名： | 来金梅 林争辉 李珂 |
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| 作者单位： | 1. 上海交通大学电子信息学院,上海,200030
2. 浙江大学信息与电子工程系,杭州,310027 |
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| 摘 要： | 大多芯片组件互连传输线的电路模型中，必须同时考虑线电感和线电阻，因此其互连延迟的研究比传统的ＰＣＢ和ＩＣ互连更具复杂性。研究了具有树状拓扑结构的ＭＣＭ互连网络的延迟：在明确了ＭＣＭ互连延迟的独特点后，着重给出了树状结构互连网络冲激响应的矩的求法，从矩与延迟的密切关系中给出了求延迟的一种有效方法。
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| 关 键 词： | 多芯片组件 树状网络 互连延迟 冲激响应的矩 |
STUDIES ON THE DELAY IN TREE-STRUCTURED MCM INTERCONNECTION NETWORKS |
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| LAI Jin-Mei,LIN Zheng-Hui,LI Ke. STUDIES ON THE DELAY IN TREE-STRUCTURED MCM INTERCONNECTION NETWORKS[J]. Journal of Computer-Aided Design & Computer Graphics, 1999, 11(1): 85-88 |
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| Authors: | LAI Jin-Mei LIN Zheng-Hui LI Ke |
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| Abstract: | In the circuit model of interconnection transmission line for MultiChip Modules, it is necessary to take into account the effects of both line inductance and line resistance. The analysis of MCMs is more comprehensive than that of traditional PCBs and ICs. This paper provides a new method to study on the delay in tree structured MCM Interconnection Networks. Firstly, it demonstrates the properties of delay in MCM circuit. Secondly, It investigates the expressions of the first several moments of tree structured interconnection networks. Lastly, from the close relation between the moments and delay, an actual approach is presented. |
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| Keywords: | MultiChip Modules tree structured interconnection networks interconnect delay moment of impulse response |
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