Elastic properties measurement of glass layers fabricated onsilicon wafers for microelectronics and micromachines |
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Authors: | Tsukahara Y. Ohira K. Yanaka M. Inaba M. Satoh A. |
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Affiliation: | Tech. Res. Inst., Toppan Printing Co. Ltd., Saitama; |
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Abstract: | Elastic properties such as the Young's modulus, the Poisson's ratio and the density of Si-B-O glass layers fabricated on (100) silicon substrates by the flame hydrolysis deposition method were measured. Thicknesses of the layers were about 20 μm. It was found that the Young's modulus decreased with the boron dopant concentration. The Poisson's ratio was about 0.26 regardless of the boron dopant concentration. The measured elastic properties will be used in the design of micromachines fabricated with silicon substrates and glass layers |
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