| 超薄硅片贴膜抛光技术研究 |
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| 引用本文： | 王云彪,陈亚楠,刘玉岭,杨红星.超薄硅片贴膜抛光技术研究[J].电子工艺技术,2011,32(1):48-50. |
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| 作者姓名： | 王云彪 陈亚楠 刘玉岭 杨红星 |
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| 作者单位： | 中国电子科技集团公司第四十六研究所,天津,300220 |
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| 摘 要： | 伴随着集成电路芯片的不断轻薄化,各种高质量的超薄抛光片衬底需求日益增加.介绍了一种简捷、方便的手动贴膜方法,并将其应用在200μm厚7.6 cm硅单晶免清洗单面抛光片加工过程中,通过与粘蜡抛光相比较,发现贴膜抛光实用性更强、成品率更高且成本更低.
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| 关 键 词： | 超薄抛光片 粘蜡抛光 贴膜 |
Research on Back Protecting Tape for Ultrathin Silicon Wafer Polishing Process |
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| WANG Yun-biao,CHEN Ya-nan,LIU Yu-ling,YANG Hong-xing.Research on Back Protecting Tape for Ultrathin Silicon Wafer Polishing Process[J].Electronics Process Technology,2011,32(1):48-50. |
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| Authors: | WANG Yun-biao CHEN Ya-nan LIU Yu-ling YANG Hong-xing |
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| Affiliation: | WANG Yun-biao,CHEN Ya-nan,LIU Yu-ling,YANG Hong-xing(The 46th Research Institute of CETC,Tianjin 300220,China) |
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| Abstract: | As IC chips become increasingly lighter,high quality of ultrathin polished wafers are demanded.Introduce a convenient method for affixing protective tape on the backside of the wafer manually,and apply it in 200 μm thickness of 7.6 cm epi-ready silicon wafer polishing process.Compare to the polishing process with wax,using tape is more practical,higher finished product ratio and lower cost. |
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| Keywords: | ultrathin polished wafers: polishing process with wax: Affix protective tape |
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