| 高密度印制板组件离心清洗工艺技术研究 |
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| 引用本文： | 阎德劲,谢明华. 高密度印制板组件离心清洗工艺技术研究[J]. 电子工艺技术, 2011, 32(1): 16-19,47 |
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| 作者姓名： | 阎德劲 谢明华 |
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| 作者单位： | 中国西南电子技术研究所,四川,成都,610036 |
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| 摘 要： | 针对低架空高度、高密度封装BGA和CSP底部难以清洗干净的难题,将离心清洗工艺技术应用于PCBA的清洗中.探讨清洗溶剂选择原则,研究离心清洗工艺原理,设计和优化了离心清洗工艺流程,设置了离心清洗工艺参数,分析以上因素对高密度印制板组件清洗效果的影响规律.清洁度检测结果表明:清洗溶剂选择正确,清洗工艺流程合理,离心清洗工...
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| 关 键 词： | 离心清洗 清洗溶剂 清洗工艺流程 离心清洗工艺参数 |
Spinning Cleaning Method Research of High Density PCBA |
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| YAN De-jin,XIE Ming-hua. Spinning Cleaning Method Research of High Density PCBA[J]. Electronics Process Technology, 2011, 32(1): 16-19,47 |
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| Authors: | YAN De-jin XIE Ming-hua |
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| Affiliation: | YAN De-jin,XIE Ming-hua(Southwest China Institute of Electronic Technology,Chengdu 610036,China) |
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| Abstract: | Aiming at the cleaning difficult problem of low tallness and high density BGA and CSP,spinning cleaning method is applied in Cleaning PCBA.Selection principle for cleaning solvent is discussed and spinning cleaning process is designed and optimized and spinning cleaning technical parameters are established.The influence rule of hereinbefore factors affecting high density PCBA is analyzed.Cleanness Test results show that cleaning solvent Selection is correct and spinning cleaning process is reasonable and pi... |
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| Keywords: | Spinning cleaning Cleaning solvent Spinning cleaning process Spinning cleaning technical parameters |
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