| 刚挠印制板镀覆孔孔壁开裂原因分析 |
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| 引用本文： | 石磊,郭晓宇.刚挠印制板镀覆孔孔壁开裂原因分析[J].电子工艺技术,2011,32(1):31-35,44. |
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| 作者姓名： | 石磊 郭晓宇 |
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| 作者单位： | 中国电子科技集团公司第十五研究所,北京,100083 |
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| 摘 要： | 为适应电子产品的发展,刚挠印制板的应用范围越来越大,用户对刚挠板性能的要求越来越高.概述了刚挠印制板镀覆孔孔壁发生开裂的原因,从基材、钻孔、孔金属化前处理和化学镀铜等角度分析并解决镀覆孔开裂问题.
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| 关 键 词： | 刚挠印制板 镀覆孔 开裂 |
Reason Analysis of Plated Through Hole Cracking in Rigid-flexible printed board |
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| SHI Lei,GUO Xiao-yu.Reason Analysis of Plated Through Hole Cracking in Rigid-flexible printed board[J].Electronics Process Technology,2011,32(1):31-35,44. |
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| Authors: | SHI Lei GUO Xiao-yu |
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| Affiliation: | SHI Lei,GUO Xiao-yu(The 15th institute of CETC,Beijing 100083,China) |
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| Abstract: | With the development of electronic products,The application range of rigid-flexible printed board is getting more wider,and the requirements for rigid-flexible printed board is getting more higher.Describe the reason of the plated through hole cracking in rigid-flexible printed board.Analysis and solution the plated through hole cracking by the base flexible material,drilling hole,electroless copper etc. |
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| Keywords: | Rigid-flexible printed board Plated through hole Crack |
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