| Ku波段宽带固态功率放大器 |
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| 引用本文： | 蔡昱,冯鹤,曹海勇. Ku波段宽带固态功率放大器[J]. 电子与封装, 2011, 11(2): 30-33 |
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| 作者姓名： | 蔡昱 冯鹤 曹海勇 |
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| 作者单位： | 南京电子器件研究所微波与毫米波专用模块电路研发部,南京,210016 |
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| 摘 要： | 近年来,随着科学技术的发展,功率合成技术发展迅猛,多种合成方案被提出来,有微带线合成、波导腔合成、辐射线合成等等,但都有各自的优势和不足.文章介绍了一种Ku波段宽带固态功率合成放大器的工程实现.固放采用多芯片多级合成,根据工程应用的实际要求,每级合成采用了不同的合成方式.文章所研究合成功率放大器的基本单元模块由两个功率...
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| 关 键 词： | 固态功率放大器 Lange桥 MMIC 波导功分器 |
A Study of Wide Frequency Ku-band High-power Solid-state Amplifier |
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| CAI Yu,FENG He,CAO Hai-yong. A Study of Wide Frequency Ku-band High-power Solid-state Amplifier[J]. Electronics & Packaging, 2011, 11(2): 30-33 |
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| Authors: | CAI Yu FENG He CAO Hai-yong |
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| Affiliation: | CAI Yu,FENG He,CAO Hai-yong(Department of MW & MMW special module circuit development,Nanjing Electronic Devices Institute,Nanjing 210016,China) |
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| Abstract: | Recently,power-combining technology has been developed rapidly.Various combining architectures have been reported such as microstrip combiner,waveguide combiner,and radial power combiner.In this paper,an engineering application of a wide frequency Ku-band SSPA(Solid-State Power Amplifier) is presented.Multi-chips combining technique is adopted in the design of SSPA.To meet the engineering request of the product,different combining structures have been used on different levels.The 9W modules are combined by ... |
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| Keywords: | MMIC |
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