Interfacial Bonding Strength Between Brazing Alloys and CVD Diamond |
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Authors: | Yu-Chan Hsieh Shun-Tian Lin |
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Affiliation: | (1) Department of Mechanical Engineering, National Taiwan University of Science and Technology, 43 Keelung Road, Sec. 4, Taipei, 106, Taiwan, ROC |
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Abstract: | Three groups of brazing alloys were compared in brazing chemical-vapor-deposited (CVD) diamond, including two nickel-based
alloys (Ni-3Fe-7Cr-3B-0.5Si-0.02C and Ni-14Cr-10P-0.02C), one copper-based alloy (Cu-10Sn-15Ti), and two silver-based alloys
(Ag-5Cu-1Al-1.25Ti and Ag-34.25Cu-1In-1.75Ti). The nickel-based alloys catalytically transformed the sp3-bonded diamond into sp2-bonded carbon during high-temperature brazing operation though with the existence of Cr as the active metal. The bonding
strength was very low and the fracture primarily propagated through the sp2-bonded carbon. For Cu-10Sn-15Ti brazing alloy, the transformation of the sp3-bonded diamond into sp2-bonded carbon during high-temperature brazing operation was marginal. The bond strength was adequate and fracture took place
primarily through the brazing alloy bulk, due to the high concentrations of Sn and Ti that caused the precipitation of abundant
intermetallic compounds in the brazing alloy bulk. For Ag-based alloys having very low concentrations of Ti, no visible degradation
of diamond was observed and the bonding strength was very high. Crack primarily propagated through the brazed interface or
even the CVD diamond bulk. |
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Keywords: | brazing heat treating joining material selection |
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