| 深亚微米多层互连的温度分布特性分析 |
| |
| 引用本文： | 董刚,冷鹏,柴常春,杨银堂. 深亚微米多层互连的温度分布特性分析[J]. 电路与系统学报, 2010, 15(5) |
| |
| 作者姓名： | 董刚 冷鹏 柴常春 杨银堂 |
| |
| 作者单位： | 西安电子科技大学,微电子所,宽禁带半导体材料与器件教育部重点实验室,陕西,西安,710071 |
| |
| 基金项目： | 国家自然科学基金，国家杰出青年基金，西安电子科技大学基本科研业务费资助项目 |
| |
| 摘 要： | 本文从热扩散方程出发,推导了简单互连的温度分布解析表达式,采用65nm工艺参数,详细讨论了热扩散长度和介质层厚度对互连温度分布的影响;进一步给出了复杂多层互连的温度分布解析表达式并用于其特性模拟,结果显示全局互连的温升远大于半全局互连和局部互连的温升。
|
| 关 键 词： | 多层互连 温度分布 热扩散长度 深亚微米 |
Temperature characteristic analysis of multilevel interconnects in DSM |
| |
| DONG Gang,LENG Peng,CHAI Chang-chun,YANG Yin-tang. Temperature characteristic analysis of multilevel interconnects in DSM[J]. Journal of Circuits and Systems, 2010, 15(5) |
| |
| Authors: | DONG Gang LENG Peng CHAI Chang-chun YANG Yin-tang |
| |
| Affiliation: | DONG Gang,LENG Peng,CHAI Chang-chun,YANG Yin-tang ( Key Laboratory of Ministry of Education for Wide B,-Gap Semiconductor Materials , Devices,Microelectronics Institute,Xidian University,Xian 710071,China ) |
| |
| Abstract: | In this paper, temperature distribution of simple interconnect is first derived based on the heat diffusion equation. Adopting parameters for 65nm process, the impacts of heat diffusion length and ILD thickness on temperature distribution are also discussed in detail. Then, the compact temperature distribution model of multilevel interconnects is derived and used for simulation. Results show that the temperature rise of global interconnects is quite larger comparing to the semiglobal and local interconnects... |
| |
| Keywords: | multilevel interconnects temperature distribution heat diffusion length deep submicron meter |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
