电解铜箔截面微观组织的EBSD分析

目的 通过树脂包埋结合离子截面抛光的制备方法，实现铜箔样品的截面EBSD分析，进而利用截面EBSD分析方法探究电流密度对铜箔组织性能的影响。方法 通过使用热固性树脂对铜箔进行包埋，使用加热平台使胶体凝固，对得到的包埋好的铜箔试样在砂纸上进行截面打磨，放入截面离子抛光仪中进行离子切割，样品制备完成后，将样品取下。使用电子背散射(EBSD)作为电镜附件，进行晶体学取向的表征。结果 结合截面微观组织的EBSD分析方法，分析了电流密度对铜箔组织性能的影响，结果表明，随着电流密度的增大，电解铜箔的晶粒尺寸呈现出先减小后增大的趋势，孪晶密度和位错密度呈现出先增大后减小的趋势，抗拉强度在45 A/dm²时达到最大547.05 MPa。结论 该方法可以利用EBSD分析软件自动分析铜箔截面的晶粒粒度分布、孪晶密度等，并将这些微观结构特征与力学性能结果进行详细对比分析，验证了电流密度对铜箔组织和性能的显著影响。

EBSD Analysis of the Cross-sectional Microstructure of Electrolytic Copper Foil

The work aims to realize the cross-sectional EBSD analysis of copper foil samples by resin embedding combined with cross-sectional ion polishing, and then explore the effect of current density on the microstructure and properties of copper foil by the cross-sectional EBSD analysis method. The copper foils were embedded with thermosetting resin and the colloidal mixture was solidified with a heating platform. Subsequently, the cross section of embedded copper foil samples were meticulously polished on sandpaper and then put into a cross-sectional ion polishing instrument for ion cutting. Upon the completion of sample preparation, Electron Backscatter Diffraction (EBSD) was employed as a microscopy attachment to characterize the crystal preferred orientation. Combined with the EBSD analysis method of cross-sectional microstructure, the effect of current density on the microstructure and properties of copper foil was analyzed. With the increase of current density, the grain size of electrolytic copper foil firstly decreased and then increased, while the twin density and dislocation density firstly increased and then decreased, and the tensile strength reached the maximum of 547.05 MPa at 45 A/dm2. This method can automatically analyze the grain size distribution and twin density of copper foil cross section by EBSD analysis software, and compare the analysis results with the performance results.