基于Moldflow的电器面板翘曲分析

以电器面板外壳为实例,针对目前模具注塑过程中发生的收缩翘曲问题,通过Moldflow软件进行模拟分析,给出了注塑件影响翘曲的主要因素。主要是对电器面板进行工艺分析,建立翘曲理论公式考虑影响翘曲的主要因素,确定合理的浇口方案,然后通过Moldflow对两个不同的浇口方案进行分析比较,包括纤维的取向分析以及各方向变形量进行一定的比较。软件研究表明,浇口的位置和数量对翘曲变形有很大程度的影响,优化浇口方案可以减小翘曲量。

Electrical panel warping analysis based on Moldflow

The electrical panel shell as an example, based on the current mold in injection molding process of shrink warp problems, by Moldflow software simulation analysis, the injection molding pieces of the main factors affecting warp is presented. Mainly process analysis was carried out on the electrical panel, set up warping theory formula considering the main factors affecting warp, determine reasonable gate scheme, and then through the Moldflow analysis on different gate scheme of two carries on the analysis comparison, including the fiber orientation analysis, and the comparison of each direction deformation for certain. Sottware research shows that： the location of the gate number and has a great influence on the buckling deformation, can reduce the amount of warp gate and optimization scheme.