| 用铜粉处理酸性镀铜溶液中的氯离子 |
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| 引用本文： | 郭崇武. 用铜粉处理酸性镀铜溶液中的氯离子[J]. 涂装与电镀, 2008, 0(6) |
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| 作者姓名： | 郭崇武 |
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| 作者单位： | 肇庆市华良金属精饰制品有限公司; |
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| 摘 要： | 研究了用铜粉处理酸性镀铜溶液中氯离子的机理和方法,实验表明,向酸性镀铜溶液中加入铜粉,金属铜与Cu2+离子和氯离子反应生成氯化亚铜沉淀。用铜粉处理酸性镀铜溶液中的氯离子效果较好,向镀液中加铜粉1g/L,氯离子的去除率为58.9%,而向镀液中加锌粉1g/L,氯离子的去除率为36.8%。
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| 关 键 词： | 酸性镀铜 氯离子 铜粉 处理 |
Treatment of Chloride Ion in an Acidic Copper Plating Bath with Copper Powder |
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| Guo Chongwu. Treatment of Chloride Ion in an Acidic Copper Plating Bath with Copper Powder[J]. Painting & Electroplating, 2008, 0(6) |
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| Authors: | Guo Chongwu |
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| Affiliation: | Zhaoqing City Hualiang Metal Finishing Product Co.;Ltd;Zhaoqing 526105 |
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| Abstract: | The mechanism and method for treating the chloride ion in an acidic copper plating bath with copper powder were studied. Experimental tests showed that, when the copper powder was added to the acidic copper solution, it reacted with Cu2+ and chloride ion to produce copper monochloride deposition. The chloride elimination rate was 58.9% after adding 1.0 g/L of copper powder to the acid copper solution, however, with the conventional method, the rate was 36.8% after 1.0 g/L of zinc powder was added to the sol... |
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| Keywords: | acidic copper plating chloride ion copper powder treatment |
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