Unexpected transient creep behavior of tin alloys strengthened by high volume fractions of SbSn |
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| Authors: | Rodney J. McCabe Morris E. Fine |
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| Affiliation: | (1) the MST-8: Structure/Property Relations Group, Division of Materials Science and Technology, Los Alamos National Laboratory, Los Alamos, NM;(2) the Department of Materials Science and Engineering, Northwestern University, Evanston, IL |
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| Abstract: | An unexpected transient creep behavior characterized by a stress exponent of 1 was observed at low stresses in tin alloys strengthened by large volume fractions (>15 pct) of the precipitate SbSn. By way of solid-state precipitation, SbSn forms as high-aspect ratio whiskers. At large volume fractions, whiskers are both directly and indirectly observed to be in direct contact with multiple other whiskers. The transient creep behavior is attributed to a phase-boundary-enhanced diffusional creep mechanism, possibly diffusional creep along continuous phase-boundary paths between tin grain boundaries. It is thought that the creep behavior is, in fact, a “steady-state” behavior characteristic of the initial microstructure. The ultimate transient nature is due to precipitate coarsening occurring with time during the creep test. |
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