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Thickness of compound layer in steel-aluminum solid to liquid bonding
作者单位:Peng Zhang,Yunhui Du,Hanwu Liu,Shuming Xing,Daben Zeng,Jianzhong Cui,and Limin Ba 1)Department of Mechanical Engineering,Northern Jiaotong University,Beijing 100044,China 2)Department of Mechanical Engineering,Tsinghua University,Beijing 100084,China 3)Metal Forming Department,Northeastern University,Shenyang 110006,China 4)Anshan Automobile Fittings Factory,Anshan 114014,China
基金项目:国家自然科学基金,Project of Advanced Technical Committee of China 
摘    要:The bonding of solid steel plate to liquid aluminum was studied using rapid solidification. The surface of solid steel plate was defatted, descaled, immersed (in K2ZrF6 flux aqueous solution) and stoved. In order to determine the thickness of Fe-AI compound layer at the interface of steel-aluminum solid to liquid bonding under rapid solidification, the interface of bonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationship between bonding parameters (such as preheat temperature of steel plate, temperature of aluminum liquid and bonding time) and thickness of Fe-AI compound layer at the interface was established by artificial neural networks (ANN) perfectly. The maximum of relative error between the output and the desired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacial shear strength of bonding plate (226℃for preheat temperature of steel plate, 723℃ for temperature of aluminum liquid and 15.8 s for bonding time), the reasona


Thickness of compound layer in steel-aluminum solid to liquid bonding
Authors:Peng Zhang  Yunhui Du  Hanwu Liu  Shuming Xing  Daben Zeng  Jianzhong Cui  Limin Ba
Abstract:The bonding of solid steel plate to liquid aluminum was studied using rapid solidification. The surface of solid steel plate was defatted, descaled, immersed (in K2ZrF6 flux aqueous solution) and stoved. In order to determine the thickness of Fe-A1 compound layer at the interface of steel-aluminum solid to liquid bonding under rapid solidification, the interface of bonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationship between bonding parameters (such as preheat temperature of steel plate, temperature of aluminum liquid and bonding time) and thickness of Fe-Al compound layer at the interface was established by artificial neural networks (ANN) perfectly. The maximum of relative error between the output and the desired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacial shear strength of bonding plate (226℃ for preheat temperature of steel plate, 723 ℃ for temperature of aluminum liquid and 15.8 s for bonding time), the reasonable thickness of Fe-A1 compound layer 10.8 μm was got.
Keywords:bonding of steel plate to liquid aluminum  rapid solidification  thickness of Fe-Al compound layer  artificial neural networks
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