Temperature and strain rate dependence of cyclic deformation response and damage accumulation in ofhc copper and 304 stainless steel

The effects of temperature and strain rate on deformation behavior and dislocation structure were investigated for OFHC copper and type 304 stainless steel. It is shown that the cyclic stress response is inversely related to the cell size for copper cycled at different temperatures ranging from -75 to 650°C. Type 304 stainless steel underwent a change from a planar to a wavy slip character as the temperature was changed from room temperature to 760°C. At elevated temperatures, cells were observed and the size of the cells tended to increase with increase in temperature. The effects of temperature on the cyclic stress-strain parameters were investigated for copper, type 304 stainless steel and Ferrovac “E” iron. On studying the effects of temperature and strain rate on the fracture mechanisms it was found that a time dependent fracture mode was dominant at high temperature levels and low strain rates. However, at high strain rates the life was insensitive to temperature. The role of grain boundary migration on the fracture process was investigated. Grain boundary migration was found to be dependent on strain rate for copper. However, for type 304 stainless steel, the grain boundary migration was inhibited at high temperature (760°C) due to the presence of precipitates at the grain boundaries. In strain cycling of OFHC copper and type 304 stainless steel, it was found that the addition of creep-type damage to fatigue damage resulted in a total damage which was not equal to unity for failure when these different modes were imposed sequentially. The sense of the damage accumulation appeared to have no effect on this summation.