助焊剂组成对SAC105锡膏铺展及焊后残留腐蚀的影响

研究了助焊剂中活性剂、成膏体、酸碱调节剂对Sn1.0Ag0.5Cu(SAC105)锡膏铺展和焊后残留腐蚀的影响。结果表明,活性剂含量小于8%(质量分数)时,锡膏铺展率随活性剂含量的增加而增大,锡膏焊后SIR值随活性剂质量分数的提高而减小,活性剂含量为9%,焊后SIR值降至1.6×10^9Ω;成膏体为PEG2000复配改性环氧树脂A时,锡膏铺展率为81.4%,焊后残留腐蚀较少,焊后10天的SIR值基本稳定在1.5×10^11Ω,成膏体为松香时,锡膏铺展率为82.6%,焊后10天的SIR值为4.0×10^9Ω;加入一定量的酸碱调节剂三乙醇胺能提高锡膏的铺展率、降低助焊剂p H值及焊后SIR值,当三乙醇胺含量为1.0%时,焊后SIR值最大,为1.6×10^12Ω。

Effects of compositions of flux on SAC105 solder paste spreading ratio and post-soldering residual corrosion

Effects of active agent,paste and acidity regulator of Sn1.0 Ag0.5 Cu solder paste flux on spreading ratio and post-soldering residual corrosion were studied.The results showed that the increase of active agent content is beneficial to the spreading ratio of solder paste when the content of active agent was below 8%(mass fraction,the same below).The post-soldering SIR value decreases as the content of active agent increased.The post-soldering SIR value decreased to 1.6×10^9Ωat the content of active agent of 9%.The spreading ratio is 81.4%and less post-soldering residual corrosion can be achieved when PEG2000 and modified epoxy resin was used as paste for the solder paste.The SIR value of this type of solder paste remains at 1.5×10^11Ωafter soldering for 10 days.The spreading ratio is 82.6%and the SIR value was 4.0×10^9Ωwhen rosin was used as paste for the solder paste.The spreading ratio of the solder paste increases while the p H of flux and the postsoldering SIR value were decreased after triethanolamine being added as acidity regulator.The post-soldering SIR value reaches up to the maximum of 1.6×10^12Ωat the content of triethanolamine of 1.0%.