| Abstract: | The effect of an organically modified montmorillonite (OMMT) on the curing kinetics of a thermoset system based on a bisphenol A epoxy resin and a poly(oxypropylene)diamine curing agent were studied by means of differential scanning calorimetry (DSC) in isothermal and dynamic (constant heating rate) conditions. Montmorillonite and prepared composites were characterized by X‐ray diffraction analysis (XRD) and simultaneous differential scanning calorimetry–thermogravimetric analysis (DSC–TGA). Analysis of DSC data indicated that the presence of the filler has a very small effect on the kinetics of cure. A kinetic model, arising from an autocatalyzed reaction mechanism, was applied to the DSC data. Fairly good agreement between experimental and modeling data was obtained. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 550–557, 2006 |
