| Ag,Cu对Sn-40Bi钎料合金钎焊性能和显微组织的影响 |
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| 引用本文： | 李继平,卫国强,康云庆. Ag,Cu对Sn-40Bi钎料合金钎焊性能和显微组织的影响[J]. 焊接, 2019, 0(8): 13-16,I0024 |
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| 作者姓名： | 李继平 卫国强 康云庆 |
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| 作者单位： | 华南理工大学,广州,510640;华南理工大学,广州,510640;华南理工大学,广州,510640 |
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| 基金项目： | 国家自然科学基金;中山瀚华锡业有限公司资助项目 |
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| 摘 要： | 利用DSC,显微硬度仪以及SEM研究了合金元素Ag,Cu对Sn-40Bi钎料合金熔化特性、润湿铺展性、显微硬度以及焊点显微组织的影响。试验结果表明,在试验参数内随着Ag,Cu含量的增加,钎料的熔程减少,润湿铺展面积和维氏硬度增加,焊点中的Bi相得以细化。
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| 关 键 词： | Sn-Bi钎料 熔化特性 润湿铺展性 显微硬度 焊点组织 |
| 收稿时间： | 2018-12-21 |
Effects of Ag and Cu on soldering properties and microstructure of Sn-40Bi solder alloy |
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| Li Jiping,Wei Guoqiang,Kang Yunqing. Effects of Ag and Cu on soldering properties and microstructure of Sn-40Bi solder alloy[J]. Welding & Joining, 2019, 0(8): 13-16,I0024 |
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| Authors: | Li Jiping Wei Guoqiang Kang Yunqing |
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| Affiliation: | (South China Universityof Technology,Guangzhou 510640,China) |
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| Abstract: | The effects of alloying elements Ag and Cu on the melting properties,wettability,spreadability,microhardness and microstructures of Sn-40Bi solder alloy were studied by DSC,microhardness tester and SEM.The results show that with the increase of Ag and Cu content,the melting range of the solder decreases,the wetting spreading area and Vickers hardness increase,and the Bi phase in the soldered joint is refined. |
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| Keywords: | Sn-Bi solder melting property wettability hardness soldered joint microstructure |
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