新型平板热管的传热性能研究

为了提高普通蒸汽腔平板热管的机械强度和传热性能，提出了一种热端与冷端之间设有液态工质回流柱的新型平板热管，并对以该种平板热管为热扩散基板的集成模块的传热性能进行了实验研究。研究结果表明，在热耗散功率较大时，平板热管基板模块的结壳热阻、管芯至基板间热阻均比纯铜基板模块小，而且其结壳热阻分别比同厚度和同重量的纯铜基板模块的结壳热阻小30％和40％。该结果说明新型平板热管比纯铜基板具有更好的热扩散性能，适合于大功率模块设计

Heat transfer research on a novel flat heat pipe (FHP)

A novel flat heat pipe (FHP) was proposed to enhance the mechanical strength and thermal performance of the FHP with a vapor chamber. In the novel FHP, there are poles inside the vapor chamber connecting hot side and cold side. By these poles, working fluid can flow from the cold side to the hot side. Thermal performance test was done to an integrated power electronics module (IPEM) based on this novel FHP. Test results show that both the junction to case thermal resistance and thermal resistance between the chip and substrate of the module are lower than that of the module based on copper substrate when the module works under the condition of large heat dissipation. Especially the junction to case thermal resistance of the module based on FHP is respectively 30% and 40% lower than that of the module based on cooper substrate with the same thickness and the same weight. Theses conclusions show that the novel heat pipe is more proper than the solid copper to be thermal spreader of the power module with large heat dissipation