| 电子封装器件BGA的实时全息干涉实验研究 |
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| 引用本文： | 王卫宁,张存林,吴一平,王朝阳.电子封装器件BGA的实时全息干涉实验研究[J].四川激光,1999,20(3). |
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| 作者姓名： | 王卫宁 张存林 吴一平 王朝阳 |
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| 作者单位： | 首都师范大学物理系，华中理工大学材料系，清华大学工程力学系 |
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| 摘 要： | ９０年代以来，表面封装器件（ＳＭＤ）向高密度化、精密化、薄型化和高集成化方向快速地发展。在研究这些新型电子封装的应力—应变实验技术中，全息干涉测量方法因其高灵敏度、高精度、非接触性、全场分析，可直接获取离面位移等优点而被作为表面安装技术（ＳＭＴ）可靠性分析的有效方法。本文采用实时全息干涉方法对加电运行中的ＰＢＧＡ器件及外部热辐射条件下ＰＢＧＡ的离面变形进行了测量，得到ＰＢＧＡ呈球面弯曲及马鞍形翘曲变形的实验结果，并初步分析了产生形变差异的原因。
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| 关 键 词： | 实时全息干涉 热变形 |
Studies of thermal deformation in PBGA assembly using real-time holographic interferometry |
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| Wang Weining,Zhang Cunlin,Wu Yiping,Wang Zhaoyang.Studies of thermal deformation in PBGA assembly using real-time holographic interferometry[J].Laser Journal,1999,20(3). |
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| Authors: | Wang Weining Zhang Cunlin Wu Yiping Wang Zhaoyang |
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| Abstract: | In this paper,a non destructive testing method based on the real time holographic interferometry (RTHI) is used to investigate the dynamic out of plane deformation of a PBGA PCB assembly.The deformation types of the ball shape out of bending and saddle shape warpage under the conditions of the different electronic power heating are found.In addition,the characteristics of the fringe fields of single PBGA and PBGA in a computer mother board are compared and the cause producing different fringe fields is analyzed. |
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| Keywords: | PBGA |
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