| 单片机辅助温升测试装置的研制 |
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| 引用本文： | 曹敏年.单片机辅助温升测试装置的研制[J].上海工程技术大学学报,1994,8(2):56-61. |
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| 作者姓名： | 曹敏年 |
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| 作者单位： | 上海工程技术大学计算机与电子电气工程系!上海200335 |
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| 摘 要： | 温升试验是低压电器型式试验项目之一。本文叙述了用单片机实现温升测试新方法的概况,并介绍了装置的性能、硬件设计及部分软件框图。
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| 关 键 词： | 温升试验 时间常数 热电偶 微处理机 |
THE DEVELOPMENT OF THE TEMPERATURE RISE MEASURING INSTRUMENT AIDED BY SINGLE CHIP MICROCONTROLLER |
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| Cao Minnian.THE DEVELOPMENT OF THE TEMPERATURE RISE MEASURING INSTRUMENT AIDED BY SINGLE CHIP MICROCONTROLLER[J].Journal of Shanghai University of Engineering Science,1994,8(2):56-61. |
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| Authors: | Cao Minnian |
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| Affiliation: | Cao Minnian |
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| Abstract: | Temperature rise test is one of the tests of low voltage switchgcars. This paper presents a new method to measure the temperature rise of electrical devices by using single chip microcontrollers. It also describes the performances of an instrument meant to apply this new method, hardware designs and some program charts for the instrument. This instrument has shown many advantages and met all the designingtargcts. |
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| Keywords: | Temperature rise test Time constant Thermocouple Microprocessors |
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