| 湿固化聚氨酯热熔胶的研究近况及展望 |
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| 引用本文： | 唐礼道,杨建军,张建安,吴庆云,吴明元.湿固化聚氨酯热熔胶的研究近况及展望[J].聚氨酯工业,2006,21(5):9-12. |
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| 作者姓名： | 唐礼道 杨建军 张建安 吴庆云 吴明元 |
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| 作者单位： | 安徽大学化学化工学院与安徽省绿色高分子材料重点实验室,合肥,230039 |
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| 摘 要： | 叙述了湿固化聚氨酯热熔胶的特点、应用,重点介绍了它的主要组成及性能和近年来湿固化聚氨酯热熔胶的研究成果,并展望了其发展趋势。
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| 关 键 词： | 聚氨酯 热熔胶 湿固化 研究近况 |
| 收稿时间： | 2006-01-19 |
| 修稿时间： | 2006-01-192006-09-22 |
Recent Development and Expectation of Moisture-cure Polyurethane Hot Melt Adhesives |
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| Tang Lidao,Yang Jianjun,Zhang Jianan,Wu Qingyun,Wu Mingyuan.Recent Development and Expectation of Moisture-cure Polyurethane Hot Melt Adhesives[J].Polyurethane Industry,2006,21(5):9-12. |
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| Authors: | Tang Lidao Yang Jianjun Zhang Jianan Wu Qingyun Wu Mingyuan |
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| Affiliation: | School of Chemistry and Chemical Engineering and the Key Laboratory of Environment-friendly Polymer Materials of Anhui Province, Anhui University, Hefei 230039 |
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| Abstract: | The characteristics and applications of the moisture-cure polyurethane hot melt adhesives(HMPUR) was introduced.The Component and performance of the HMPUR were stress introduced,and the prospects were also predicated. |
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| Keywords: | polyurethane hot melt adhesives moisture-cure recent development |
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