| 焊膏印刷技术及无铅化对其的影响 |
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| 引用本文： | 史建卫,何鹏,钱乙余,袁和平. 焊膏印刷技术及无铅化对其的影响[J]. 电子工业专用设备, 2006, 35(12): 29-38 |
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| 作者姓名： | 史建卫 何鹏 钱乙余 袁和平 |
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| 作者单位： | 哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江,哈尔滨,150001;日东电子科技(深圳)有限公司,广东,深圳,518103;哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江,哈尔滨,150001;日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 伴随电子组装的高密度和元件的微小化,细间距引脚对焊膏印刷提出了更高要求。为了保证产品质量,制定合理的印刷工艺,针对焊膏印刷技术及工艺参数设定进行了探讨,提出了改进焊膏印刷技术的工艺和方法。
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| 关 键 词： | 焊膏 丝网印刷 模板印刷 流变性 印刷缺陷 |
| 文章编号： | 1004-4507(2006)12-0029-10 |
| 收稿时间： | 2006-11-25 |
| 修稿时间： | 2006-11-25 |
Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology |
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| SHI Jian-wei,HE peng,QIAN Yi-yu,YUAN He-ping. Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology[J]. Equipment for Electronic Products Marufacturing, 2006, 35(12): 29-38 |
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| Authors: | SHI Jian-wei HE peng QIAN Yi-yu YUAN He-ping |
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| Affiliation: | 1.Harbin Institute of Technology, Harbin 150001 China; 2.Sun East Electronic technology (ShenZhen |
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| Abstract: | With higher density assembly and smaller devices, fine pitch leader requires perfect solder printing quality. In order to ensure product quality and establish proper printing process windows, we discuss the printing technology of solder paste and setting of process parameter, and present relevant improvement measures. |
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| Keywords: | Solder paste Mesh screen printing Metal stencil printing Rheological characteristic Printing defect |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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