| 半孔板的半孔冲切可行性评估 |
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| 引用本文： | 刘修坤,刘春生,肖亚丽.半孔板的半孔冲切可行性评估[J].印制电路信息,2011(11):33-36. |
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| 作者姓名： | 刘修坤 刘春生 肖亚丽 |
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| 作者单位： | 统赢软性电路（珠海）有限公司,广东珠海,519040 |
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| 摘 要： | 目前PCB行业对于半孔的制作方法,主要采用二次钻法或二次铣法,成本高,生产周期长,而且不利于低碳环保的理念。于是导入冲切半孔这个课题,并评估其可行性。
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| 关 键 词： | 半孔板 冲板 低碳环保 可行性 板厚 孔径 |
The feasibility evaluation of punching PCB Half-hole |
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| LIU Xiu-kun LIU Chun-sheng XIAO Ya-li.The feasibility evaluation of punching PCB Half-hole[J].Printed Circuit Information,2011(11):33-36. |
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| Authors: | LIU Xiu-kun LIU Chun-sheng XIAO Ya-li |
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| Affiliation: | LIU Xiu-kun LIU Chun-sheng XIAO Ya-li |
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| Abstract: | At present,in the PCB industry,the method of making half hole is mainly using 2nd drilling or 2nd routing.This method cost too much money and have a long production period,and against the concept of low carbon and environmental protection.So I imported the subject of punching PCB Half-hole,and then assessed the feasibility. |
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| Keywords: | PCB Half-hole punch board low carbon and environmental protection feasibility thickness of plating hole diameter |
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