不流动半固化片厚铜层压技术探讨

随刚挠板、阶梯板与金属基散热板需求量的增大,相对于纯胶片更为便宜的低流动度半固化片的使用量增多,但由于此类半固化片的溢胶量较低而往往容易导致压合白斑、白点、填胶不足等缺陷。本文通过分析对厚铜层压参数的调整,分析其影响因素,总结出NO-FLOW半固化片的压合技术点,希望能对PCB制造业同行有所帮助。

NO-FLOW Prepreg thick copper laminate technology discussion

As rigid-flexible board and ladder board and metal base plate demand increases,other than pure film,Low-flow prepreg is cheaper and used increasing,but this kind of prepreg,because of low overflow weight,so often has pressed white lines,white spots,filling defects and other defects.Through the analysis of thick laminated copper adjustment of parameters,and analysis of its influence factors,this article summed up the NO-FLOW prepreg press technology,hoping for providing help to the PCB manufacturing industry...