电解铜箔粒子类缺陷的成因分析与管控措施

铜箔作为电子电路行业中一种重要的功能性基础材料，在印制电路板、覆铜箔层压板及锂离子电池等领域被广泛应用。粒子类缺陷是电解铜箔典型的质量问题，本文对电解铜箔的生产工艺过程逐一梳理，阐释粒子类缺陷的表面形貌特征与危害。结合铜箔生产实践，重点对生箔铜瘤、表处镀铜、切屑铜粉、异物等几类典型粒子缺陷的成因进行逐一分析，总结归纳出一套涵盖监控过滤器的效果与寿命、处理生箔机台的绝缘与密封、添加剂配方的优化、处理机导电辊工况的管控、切刀的调整与更换、生产环境的洁净保障等全过程粒子类缺陷管控的有效措施。

Cause Analysis and Control of Particle Defects in Electrolytic Copper Foil

As an important functional basic material in the electronic circuit industry, copper foil is widely used in the fields of printed circuit boards, copper clad laminates and lithium-ion batteries. Particle defects are typical quality problems of electrolytic copper foil. Firstly, the production process of electrolytic copper foil is described one by one, and the surface morphological characteristics and hazards of the particle defect are described in detail. Then, combined with many years of production practice experience, the causes of the typical particle defect which are focused on green foil copper tumor, surface copper plating, chip copper powder and foreign matters etc., are analyzed one by one. Lastly, a set of effective measure of controlling particle defects in the whole process is summarized from monitoring the effect and service life of the filter, dealing with the insulation and sealing of the raw foil machine, optimizing the additive formula, controlling the working condition of the conductive roller of the processor, adjusting and replacing the cutter, and ensuring the external environment.