聚乙二醇对锂电铜箔组织性能的影响

利用直流电沉积技术在纯钛阴极上制备电解铜箔，在含有光亮剂和整平剂的电解液中加入0~6 mg/L聚乙二醇（PEG），对电解铜箔表面状态和力学性能均产生影响。随着PEG浓度增加，铜箔抗拉强度轻微增加；过量的PEG则导致铜箔表面粗糙度增大。通过扫描电子显微镜（SEM）观察铜箔表面形貌发现：加入0~4 mg/L PEG可制得表面较为平整的电解铜箔，过量的PEG会使得铜箔表面出现球状突起。

Influence of Polyethylene Glycol on Microstructure and Properties of Lithium Battery Copper Foil

Electrolytic copper foils were prepared on pure titanium cathodes by DC electrodeposition. The effect of adding 0-6 mg/L polyethylene glycol (PEG) to the electrolyte containing brightener and leveling agent on the surface state and mechanical properties of electrolytic copper foil was studied. Tensile strength slightly increases with the increase of PEG concentration; excessive PEG will lead to increased surface roughness of copper foil. The surface morphology of the copper foil was observed using a scanning electron microscope (SEM). The surface of the copper foil was observed to add 0 to 4 mg/L PEG to an electrolytic copper foil having a relatively flat surface, and an excess PEG would cause a spherical protrusion on the surface of the copper foil.