基于TPU材料的Kelvin结构缓冲性能研究

目的 探究TPU材料Kelvin结构缓冲性能，为包装缓冲减振提供新方案。方法 设计不同尺寸规格的Kelvin结构及正六边形结构，利用3D打印完成实体成型，开展力学压缩试验，进行对比分析。结果 TPU材料Kelvin结构具备较优良的压缩回弹率;随着相对密度、尺寸等级的不断增加，其最大应力相应增加;中等尺寸规格情况下，其力学性能最优;在吸收相同能量的情况下，TPU材料的Kelvin结构的应力小于正六边形结构。结论 TPU材料的Kelvin结构具备较优良的力学性能，有一定的工程适应性。

Cushioning Performance of Kelvin Structure Based on TPU Material

The work aims to explore the cushioning performance of Kelvin structure based on TPU material and provide a new solution for packaging cushioning and vibration reduction. Kelvin structures and regular hexagonal structures of different sizes and specifications were designed, 3D printing was adopted to complete the solid molding and mechanical compression test was carried out for comparative analysis. Kelvin structure based on TPU material had better compression resilience. With the continuous increase of relative density and size grade, the maximum stress increased correspondingly. In case of medium size specifications, the mechanical properties were the best. In case of absorbing the same energy, the stress of the Kelvin structure based on TPU material was less than that of the regular hexagonal structure. Kelvin structure based on TPU material has better mechanical properties and a certain degree of engineering adaptability.